Package on package thermal transfer systems and methods
US11056466B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2019 |
| Grant date | Jul 6, 2021 |
| Priority date | — |
| Expiry date | Aug 27, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Systems and methods for improving heat distribution and heat removal efficiency in PoP semiconductor packages are provided. A PoP semiconductor package includes a first semiconductor package that is physically, communicably, and conductively coupled to a stacked second semiconductor package. A gap forms between the upper surface of the first semiconductor package and the lower surface of the second semiconductor package. Additionally, interstitial gaps form between each of the PoP semiconductor packages disposed on an organic substrate. A curable fluid material, such as a molding compound, may be flowed both in the interstitial spaces between the PoP semiconductor packages and into the gap between the upper surface of the first semiconductor package and the lower surface of the second semiconductor package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.