Low voltage, low power MEMS transducer with direct interconnect capability
US11058396B2 · kind B2 · utility
4Cited by
25References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2017 |
| Grant date | Jul 13, 2021 |
| Priority date | — |
| Expiry date | Aug 2, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01S7/5208
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A transceiver includes an array of pMUT elements, where each pMUT element includes: a substrate; a membrane suspending from the substrate; a bottom electrode disposed on the membrane; a piezoelectric layer disposed on the bottom electrode; and a first electrode disposed on the piezoelectric layer. Each pMUT element exhibits one or more modes of vibration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.