Janusz Bryzek
48Patents
16h-index
44Co-inventors
81Inventor score
Filing activity: Feb 16, 1978 → Apr 29, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6229190A | Compensated semiconductor pressure sensor | Electricity | 121 | Expired |
| US6351996B1 | Hermetic packaging for semiconductor pressure sensors | Physics | 96 | Expired |
| US7518493B2 | Integrated tire pressure sensor system | Performing Operations; Transporting | 92 | Active |
| US6255728A | Rigid encapsulation package for semiconductor devices | Electricity | 68 | Expired |
| US6346742B1 | Chip-scale packaged pressure sensor | Electricity | 55 | Expired |
| US5062302A | Laminated semiconductor sensor with overpressure protection | Emerging Cross-Sectional Technologies | 54 | Expired |
| US6006607A | Piezoresistive pressure sensor with sculpted diaphragm | Physics | 48 | Expired |
| US7539003B2 | Capacitive micro-electro-mechanical sensors with single crystal silicon electrodes | Electricity | 45 | Active |
| US4879903A | Three part low cost sensor housing | Emerging Cross-Sectional Technologies | 31 | Expired |
| US7260984B2 | Power generation utilizing tire pressure changes | Performing Operations; Transporting | 27 | Expired |
| US8710599B2 | Micromachined devices and fabricating the same | Electricity | 26 | Active |
| US6559379B2 | Pressure sensor with transducer mounted on a metal base | Electricity | 24 | Expired |
| US9156673B2 | Packaging to reduce stress on microelectromechanical systems | Electricity | 20 | Active |
| US9095072B2 | Multi-die MEMS package | Electricity | 19 | Active |
| US9425328B2 | Through silicon via including multi-material fill | Performing Operations; Transporting | 18 | Active |
| US9006846B2 | Through silicon via with reduced shunt capacitance | Performing Operations; Transporting | 18 | Active |
| US6147397A | Stress isolated integrated circuit and method for making | Electricity | 16 | Expired |
| US6922500B2 | Optical configuration for optical fiber switch | Electricity | 16 | Expired |
| US6898341B2 | Optical system for calibration and control of an optical fiber switch | Electricity | 13 | Expired |
| US9735112B2 | Isolation between semiconductor components | Electricity | 13 | Active |
| US4414853A | Pressure transmitter employing non-linear temperature compensation | Physics | 11 | Expired |
| US4196382A | Physical quantities electric transducers temperature compensation circuit | Physics | 11 | Expired |
| US10835209B2 | Configurable ultrasonic imager | Physics | 9 | Active |
| US11039814B2 | Imaging devices having piezoelectric transducers | Physics | 7 | Active |
| US10065851B2 | Microelectromechanical pressure sensor including reference capacitor | Performing Operations; Transporting | 7 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.