Film forming composition
US11059995B2 · kind B2 · utility
0Cited by
4References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 3, 2018 |
| Grant date | Jul 13, 2021 |
| Priority date | — |
| Expiry date | Apr 3, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/357
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
[Problem] To provide a film forming composition curable at low temperature and a film forming method using the same. [Means for Solution] A film forming composition comprising a polysilazane, an organic solvent and aspecific additive, and a film forming method comprising applying it on a substrate and curing. The specific additive is selected from the group consisting of (A) guanidines substituted by a hydrocarbylgroup, (B) crown ether amines containing oxygen and nitrogen as a member thereof, (C) cycloalkanes having an amino-substituted polycyclic structure, (D) oximes substituted by a hydrocarbyl group, and (E) imidazolines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.