Patent · US Active

Pressure sensor die attach

US11060929B2 · kind B2 · utility

0Cited by

3References

16Claims

0Family size

Assignee

SILICON MICROSTRUCTURES, INC. · US

Inventors

Keyanoush Razavidinani · Munich, DE
Gertjan van Sprakelaar · Fremont, US
Chris Wagner · Gatineau, CA

Key dates

Filing date	Dec 20, 2019
Grant date	Jul 13, 2021
Priority date	—
Expiry date	Dec 20, 2039

Classification

Technology area (CPC G)Physics
CPC primaryG01L19/146
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

Pressure sensor systems and methods of assembling pressure sensor systems that reduce the need for accurate placement of a pressure sensor die in a pressure sensor package, reduce leakage in pressure sensor systems, and provides a consistent attachment of a pressure sensor die to a package.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.