Patent · US Active

Micromechanical pressure sensor

US11060937B2 · kind B2 · utility

0Cited by

2References

9Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Ferenc Lukacs · Lenti, HU
Arne Dannenberg · Metzingen, DE
Friedjof Heuck · Stuttgart, DE
Helmut Grutzeck · Tübingen, DE
Mike Schwarz · Aspenhausiedlung, DE
Robert Maul · Reutlingen, DE
Tamas Dögei · Nagykáta, HU
Thomas Friedrich · Bietigheim-Bissingen, DE
Volkmar Senz · Metzingen, DE

Key dates

Filing date	Feb 21, 2018
Grant date	Jul 13, 2021
Priority date	—
Expiry date	Jul 10, 2038

Classification

Technology area (CPC G)Physics
CPC primaryG01L19/0618
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A micromechanical pressure sensor, having—a pressure sensor core including a sensor diaphragm and a cavity developed above the sensor diaphragm; and—a pressure sensor frame; and—a spring element for the mechanical connection of the pressure sensor core to the pressure sensor frame being developed in such a way that a mechanical robustness is maximized and a coupling of stress from the pressure sensor frame into the sensor pressure core is minimized.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.