Device manufacturing method
US11061336B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Mar 28, 2018 |
| Grant date | Jul 13, 2021 |
| Priority date | — |
| Expiry date | Mar 28, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70633
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A device manufacturing method includes: exposing a first substrate using a lithographic apparatus to form a patterned layer having first features; processing the first substrate to transfer the first features into the first substrate; determining displacements of the first features from their nominal positions in the first substrate; determining a correction to at least partly compensate for the displacements; and exposing a second substrate using a lithographic apparatus to form a patterned layer having the first features, wherein the correction is applied for or during the exposing the second substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.