Device and method for treating substrates using a support roller having a porous material

US11062929B2 · kind B2 · utility

Assignee

• SINGULUS TECHNOLOGIES AG · DE

Inventors

• Jens Eckstein · Dachau, DE
• Peter Reustle · Walheim, DE
• Mathias Hohlmayer · Dießen am Ammersee, DE
• Uemit Seyhan · Singen, DE
• Benjamin MANDLMEIER · Pocking, DE
• Michael Reising · Mömbris, DE
• Stefan Kempf · Alzenau, DE
• Jan-Christof Jacobi · Steffenberg, DE

Key dates

• Filing date: Dec 17, 2018
• Grant date: Jul 13, 2021
• Expiry date: Jun 19, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/6776
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A device for treating substrates by a treating liquid has at least one rotatably supported support roller which a substrate to be treated rests on during operation. The support roller has a hollow cylinder having a porous rigid material which the substrate to be treated rests on during operation. The device is configured to deliver, during operation, treating liquid via the interior of the hollow cylinder of the at least one support roller through the porous rigid material to the external surface of the hollow cylinder in order to treat at least one surface of the substrate by the treating liquid. The device is configured to treat several substrates in the form of plate-shaped separate wafers arranged one behind the other and/or next to one another in the device, by the treating liquid and to transport the substrates in a transport plane during the treatment.