Package structure and method and equipment for forming the same
US11062971B2 · kind B2 · utility
4Cited by
23References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2019 |
| Grant date | Jul 13, 2021 |
| Priority date | — |
| Expiry date | Apr 1, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A packaged semiconductor device and a method and apparatus for forming the same are disclosed. In an embodiment, a method includes bonding a device die to a first surface of a substrate; depositing an adhesive on the first surface of the substrate; depositing a thermal interface material on a surface of the device die opposite the substrate; placing a lid over the device die and the substrate, the lid contacting the adhesive and the thermal interface material; applying a clamping force to the lid and the substrate; and while applying the clamping force, curing the adhesive and the thermal interface material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.