Patent · US Active

Semiconductor package authentication feature

US11063000B2 · kind B2 · utility

2Cited by

17References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Stefan Dankowski · Hersbruck, DE
Tim Gutheit · Ulm, DE
Bernhard Lippmann · Landshut, DE

Key dates

Filing date	Jan 29, 2019
Grant date	Jul 13, 2021
Priority date	—
Expiry date	Feb 15, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/48247
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A carrier having one or more conductive terminals is provided. A semiconductor die is mounted on the carrier. The semiconductor die is electrically connected to the one or more conductive terminals. The semiconductor die is encapsulated with an electrically insulating mold compound. A verification rule that tests whether inputted information satisfies authentication criteria is created. A first identification feature is formed on a metal structure that is encapsulated by the mold compound. The first identification feature comprises one or more symbols from a first data representation scheme that are covered by the mold compound. The one or more symbols of the first identification feature are selected to convey information that satisfies the authentication criteria of the verification rule.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.