Warpage reduction device and warpage reduction method
US11065805B2 · kind B2 · utility
0Cited by
3References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 9, 2018 |
| Grant date | Jul 20, 2021 |
| Priority date | — |
| Expiry date | Jun 29, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A warpage reduction device the present disclosure includes a jig having a warped shape capable of distributing stress of a workpiece, a light source heating the workpiece so as to be flat, a pressurizer applying pressure to the heated workpiece to be pressed against the jig so as to be deformed, a cooler cooling the deformed workpiece, and a controller controlling operations of the light source, the pressurizer, and the cooler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.