Cleaning agent composition for semiconductor device substrate, method of cleaning semiconductor device substrate, method of manufacturing semiconductor device substrate, and semiconductor device substrate
US11066627B2 · kind B2 · utility
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17Claims
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Key dates
| Filing date | Sep 13, 2019 |
| Grant date | Jul 20, 2021 |
| Priority date | — |
| Expiry date | Sep 13, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
According to the present invention, there is provided a cleaning agent composition for a semiconductor device substrate including at least one of wiring and an electrode in which the wiring and the electrode contain cobalt or a cobalt alloy, the cleaning agent composition including a component (A): at least one compound selected from the group consisting of specific compounds; and a component (B): water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.