Method and system for backside planar view lamella preparation
US11069509B1 · kind B1 · utility
0Cited by
4References
20Claims
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Key dates
| Filing date | Mar 16, 2020 |
| Grant date | Jul 20, 2021 |
| Priority date | — |
| Expiry date | Mar 20, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/31745
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The backside of a planar view lamella is prepared from a sample extracted from a workpiece. The sample includes multiple device layers and a substrate layer. After removing at least a part of the substrate layer covering a final device layer to obtain a sample surface, a region of interest (ROI) relative to the sample surface is alternately scanned with an electron beam and spontaneously etched until the final device layer within the ROI is exposed. One or more device layers may be removed from the sample backside after the final device layer is exposed to obtain the backside of the planar view lamella.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.