Interconnect structure and electronic device employing the same
US11069619B2 · kind B2 · utility
3Cited by
1References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 2, 2019 |
| Grant date | Jul 20, 2021 |
| Priority date | — |
| Expiry date | Feb 1, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76868
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An interconnect structure and an electronic device including the interconnect structure are disclosed. The interconnect structure may include a metal interconnect having a bottom surface and two opposite side surfaces surrounded by a dielectric layer, a graphene layer on the metal interconnect, and a metal bonding layer providing interface adhesion between the metal interconnect and the graphene layer. The metal bonding layer includes a metal material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.