Light-emitting device package, display device including the same, and method of manufacturing the same
US11075250B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 15, 2019 |
| Grant date | Jul 27, 2021 |
| Priority date | — |
| Expiry date | Apr 15, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/871
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A light-emitting device package is provided. The light-emitting device package includes: a substrate having a first surface and a second surface, and having a first opening and a second opening spaced apart from each other; a light-emitting structure disposed on the first surface of the substrate and vertically overlapping the first opening; and an image sensor including a photoelectric conversion region, the photoelectric conversion region being disposed in the substrate and vertically overlapping the second opening. Light from the light-emitting structure is emitted toward the second surface of the substrate through the first opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.