Semiconductor device having probe pads and seal ring
US11088037B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2019 |
| Grant date | Aug 10, 2021 |
| Priority date | — |
| Expiry date | Jan 22, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a substrate including a circuit region and an outer border, a plurality of detecting devices disposed over the substrate and located between the circuit region and the outer border, first and second probe pads electrically connected to two ends of each detecting device, and a seal ring located between the outer border of the substrate and the detecting devices. A method for detecting defects in a semiconductor device includes singulating a die having a substrate, a plurality of detecting devices, a first probe pad and a second probe pad electrically connected to two ends of each detecting device, and a seal ring; probing the first and the second probe pads to determine a connection status of the detecting devices; and recognizing a defect when the connection status of the detecting devices indicates an open circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.