Additive manufacturing technology (AMT) low profile signal divider
US11089687B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2019 |
| Grant date | Aug 10, 2021 |
| Priority date | — |
| Expiry date | Jun 16, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0207
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a power divider circuit includes milling a conductive material disposed upon a first substrate to form a signal trace. The signal trace includes a division from a single trace to two arm traces, with each of the two arm traces having a proximal end electrically connected to the single trace and a distal end electrically connected to each of two secondary traces. The method further includes depositing a resistive ink between the two distal ends to form a resistive electrical connection between the two arm traces, bonding a second substrate to the first substrate to substantially encapsulate the traces between the first substrate and the second substrate, and milling through at least one of the first substrate or the second substrate to provide access to at least one of the traces. A signal divider is further disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.