Reconfigurable storage thermal dissipation
US11089717B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2019 |
| Grant date | Aug 10, 2021 |
| Priority date | — |
| Expiry date | Jun 27, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20436
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A storage device includes a bottom surface, a plurality of sides, and a top surface. The top surface integrally couples to the plurality of sides. The bottom surface, the plurality of sides, and the top surface form an outer surface of the storage device. The top surface, when coupled to the bottom surface, contacts one or more internal components of the storage device. The top surface comprises a plurality of finned ridges and a smooth continuous mounting surface. The plurality of finned ridges protrudes away from the outer surface of the storage device. The plurality of finned ridges is formed to direct heat away from the storage device. The smooth continuous mounting surface is configured to accept attachment of a thermal dissipation module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.