Post etch residue cleaning compositions and methods of using the same
US11091727B2 · kind B2 · utility
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17Claims
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Key dates
| Filing date | Jun 28, 2019 |
| Grant date | Aug 17, 2021 |
| Priority date | — |
| Expiry date | Jun 28, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A microelectronic device (semiconductor substrate) cleaning composition is provided that comprises water; oxalic acid, and two or more corrosion inhibitors and methods of using the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.