Device and method for realizing high-speed temperature drop of micro material by droplet cooling
US11092560B2 · kind B2 · utility
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7Claims
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Key dates
| Filing date | Mar 29, 2019 |
| Grant date | Aug 17, 2021 |
| Priority date | — |
| Expiry date | Nov 5, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N25/02
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention discloses an apparatus for realizing high-speed cooling of a trace material by using liquid drop cooling, which comprises an injector connected with an injection driver and used for dropwise adding a volatile cooling liquid; a temperature sensor placed below the injector; a data collector used for collecting a thermopile signal and a heating resistor signal of the temperature sensor; a gas purger used for purging a cooled sample; and a control center, wherein the injector, the temperature sensor, the data collector and the gas purger are all connected with the control center.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.