Qing Ji
17Patents
6h-index
43Co-inventors
66Inventor score
Filing activity: Jan 5, 1999 → Dec 6, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6768120B2 | Focused electron and ion beam systems | Electricity | 64 | Expired |
| US5945677A | Focused ion beam system | Electricity | 42 | Expired |
| US7312534B2 | Interlayer dielectric and pre-applied die attach adhesive materials | Emerging Cross-Sectional Technologies | 30 | Expired |
| US6975072B2 | Ion source with external RF antenna | Electricity | 22 | Expired |
| US7084407B2 | Ion beam extractor with counterbore | Electricity | 21 | Expired |
| US7550825B2 | Interlayer dielectric and pre-applied die attach adhesive materials | Emerging Cross-Sectional Technologies | 15 | Active |
| US7609815B2 | High brightness—multiple beamlets source for patterned X-ray production | Electricity | 5 | Active |
| US8729806B2 | RF-driven ion source with a back-streaming electron dump | Electricity | 3 | Active |
| US10912184B2 | Wafer-based charged particle accelerator, wafer components, methods, and applications | Electricity | 2 | Active |
| US10383205B2 | Wafer-based charged particle accelerator, wafer components, methods, and applications | Electricity | 2 | Active |
| US8075721B2 | Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability | Emerging Cross-Sectional Technologies | 2 | Active |
| US11528063B2 | Supporting distributed massive multiple-input multiple-output (DM-MIMO) in a distributed communications system (DCS) | Electricity | 0 | Active |
| US11996914B2 | Supporting distributed massive multiple-input multiple-output (DM-MIMO) in a distributed communications system (DCS) | Electricity | 0 | Active |
| US12235231B2 | Laser heating single-sensor fast scanning calorimeter | Physics | 0 | Active |
| US9484176B2 | Advanced penning ion source | Electricity | 0 | Active |
| US11092560B2 | Device and method for realizing high-speed temperature drop of micro material by droplet cooling | Physics | 0 | Active |
| US8273606B2 | Method of fabricating a semiconductor package using a fluxing underfill composition applied to solder balls in a dip process | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.