Deep learning based adaptive regions of interest for critical dimension measurements of semiconductor substrates
US11094053B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 23, 2019 |
| Grant date | Aug 17, 2021 |
| Priority date | — |
| Expiry date | Oct 21, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A metrology system is disclosed. In one embodiment, the system includes a characterization sub-system configured to acquire one or more images of a specimen. In another embodiment, the system includes a controller configured to: receive one or more training images of a specimen from the characterization sub-system; receive one or more training region-of-interest (ROI) selections within the one or more training images; generate a machine learning classifier based on the one or more training images and the one or more training ROI selections; receive one or more product images of a specimen from the characterization sub-system; generate one or more classified regions of interest with the machine learning classifier; and determine one or more measurements of the specimen within the one or more classified regions of interest.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.