Ring removal from processing chamber
US11101115B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2020 |
| Grant date | Aug 24, 2021 |
| Priority date | — |
| Expiry date | Apr 8, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6875
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for replacing process kits that include edge rings and/or support rings in processing chambers. In one implementation, a process kit comprises a multi-segment edge ring. The multi-segment edge ring comprises a first segment, a second segment, and a first annular body. The first annular body comprises a first upper surface, a first lower surface opposite the first upper surface, a first inner surface and a first outer surface. The first segment and the second segment are connectable to form the first annular body. The first lower surface is operable to be positioned over a substrate support disposed within a processing chamber, and at least a portion of the inner surface, which is positioned between the first upper surface and the first lower surface has a diameter greater than a diameter of a substrate to be processed in the processing chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.