Patent · US Active

Systems and methods for automated robotic arm sensing

US11101163B2 · kind B2 · utility

1Cited by

4References

20Claims

0Family size

Assignee

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. · TW

Inventors

Yan Liu · Meishan City, CN
Hung-Wen Chen · Hsinchu, TW
Che-Fu Chen · Hsinchu, TW

Key dates

Filing date	Nov 13, 2018
Grant date	Aug 24, 2021
Priority date	—
Expiry date	Feb 17, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/67748
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In an embodiment, a system includes: an airlock; a first semiconductor processing chamber, a second semiconductor processing chamber; and a transfer module configured to move a sensor into and out of the first semiconductor processing chamber and the second semiconductor processing chamber, wherein the sensor is configured to: collect sensor data characterizing the first semiconductor processing chamber when within the first semiconductor processing chamber; and collect sensor data characterizing the second semiconductor processing chamber when within the second semiconductor processing chamber, wherein the transfer module, the first semiconductor processing chamber, and the second semiconductor processing chamber are within a controlled internal atmosphere on a first side of the airlock and separated by the airlock from an uncontrolled external atmosphere on a second side of the airlock.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.