Leadframe systems and related methods
US11101197B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Jul 8, 2019 |
| Grant date | Aug 24, 2021 |
| Priority date | — |
| Expiry date | Oct 10, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/49582
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Leadframe systems and related methods. Specific implementations of leadframe systems may include a die pad, a semiconductor die coupled to the die pad, where the semiconductor die has a perimeter. A leadframe may be coupled over the die pad and the semiconductor die where the leadframe has a solder dam coupled around the semiconductor die and, the solder dam has a perimeter that corresponds with the semiconductor die The die pad may have no groove adjacent to the semiconductor die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.