Fast memory for programmable devices
US11101804B2 · kind B2 · utility
1Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2019 |
| Grant date | Aug 24, 2021 |
| Priority date | — |
| Expiry date | Dec 11, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06527
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit device may include a programmable fabric die having programmable logic fabric and configuration memory that may configure the programmable logic fabric. The integrated circuit device may also include a base die that may provide fabric support circuitry, including memory and/or communication interfaces as well as compute elements that may also be application-specific. The memory in the base die may be directly accessed by the programmable fabric die using a low-latency, high capacity, and high bandwidth interface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.