Distribution system for chemical and/or electrolytic surface treatment
US11105014B2 · kind B2 · utility
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13Claims
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Key dates
| Filing date | Jul 24, 2018 |
| Grant date | Aug 31, 2021 |
| Priority date | — |
| Expiry date | Jul 24, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3063
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An exemplary distribution system, apparatus and method can be provide for chemical and/or electrolytic surface treatment of a substrate in a process fluid. The distribution system can comprise a distribution body and a control unit. The distribution body can be configured to direct a flow of the process fluid and/or an electrical current to the substrate. The distribution body can comprise at least a first distribution element and a second distribution element. The control unit/device can be configured to control the first distribution element and the second distribution element separately from one another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.