SEMSYSCO GMBH
12Patents
12Active
12Granted
47Portfolio score
Filing activity: Jul 24, 2018 → Dec 2, 2021
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11164748B2 | Method and device for plating a recess in a substrate | Electricity | 1 | Active |
| US11965263B2 | Substrate holding and locking system for chemical and/or electrolytic surface treatment | Chemistry; Metallurgy | 0 | Active |
| US11566337B2 | Substrate locking system, device and procedure for chemical and/or electrolytic surface treatment | Electricity | 0 | Active |
| US11136687B2 | Substrate locking system, device and procedure for chemical and/or electrolytic surface treatment | Electricity | 0 | Active |
| US11938522B2 | Module for chemically processing a substrate | Electricity | 0 | Active |
| US12428746B2 | Distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate | Chemistry; Metallurgy | 0 | Active |
| US12351921B2 | Distribution body for a process fluid for chemical and/or electrolytic surface treatment of a substrate | Chemistry; Metallurgy | 0 | Active |
| US12261075B2 | Substrate handling device for a wafer | Electricity | 0 | Active |
| US12351935B2 | Distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate | Chemistry; Metallurgy | 0 | Active |
| US11105014B2 | Distribution system for chemical and/or electrolytic surface treatment | Electricity | 0 | Active |
| US11942356B2 | Clipping mechanism for fastening a substrate for a surface treatment of the substrate | Electricity | 0 | Active |
| US11908698B2 | Method and device for plating a recess in a substrate | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.