Apparatus for fabricating Z-axis vertical launch within a printed circuit board
US11109489B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 15, 2019 |
| Grant date | Aug 31, 2021 |
| Priority date | — |
| Expiry date | Jan 29, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1446
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (PCB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the PCB, solder an end of the segment of copper wire to a signal trace of the PCB, and flush cut an opposite end of the segment of the copper wire to a surface of the PCB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.