Resin composition and article made therefrom
US11111383B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 4, 2019 |
| Grant date | Sep 7, 2021 |
| Priority date | — |
| Expiry date | Apr 8, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2203/20
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition comprises: a vinyl-containing polyphenylene ether resin, a bis(vinylphenyl)ethane and a modification of divinylbenzene. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one of the properties including dielectric constant, dissipation factor, copper foil peeling strength, glass transition temperature, ratio of thermal expansion, thermal expansion coefficient, precipitation property of varnish, solder dipping thermal resistance, solder floating thermal resistance of multi-layer board, reflow thermal resistance of multi-layer board and T300 thermal resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.