Devices, systems and methods for electrostatic force enhanced semiconductor bonding
US11114328B2 · kind B2 · utility
1Cited by
5References
8Claims
0Family size
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Key dates
| Filing date | Nov 30, 2018 |
| Grant date | Sep 7, 2021 |
| Priority date | — |
| Expiry date | Nov 30, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76251
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various embodiments of microelectronic devices and methods of manufacturing are described herein. In one embodiment, a method for enhancing wafer bonding includes positioning a substrate assembly on a unipolar electrostatic chuck in direct contact with an electrode, electrically coupling a conductor to a second substrate positioned on top of the first substrate, and applying a voltage to the electrode, thereby creating a potential differential between the first substrate and the second substrate that generates an electrostatic force between the first and second substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.