Antenna package structure and antenna packaging method
US11114391B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 9, 2019 |
| Grant date | Sep 7, 2021 |
| Priority date | — |
| Expiry date | May 19, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides an antenna package structure and an antenna packaging method. The package structure includes a rewiring layer, wherein the rewiring layer comprises a first dielectric layer and a first metal wiring layer in the first dielectric layer; metal connecting column, formed on the first metal wiring layer of the rewiring layer; a packaging layer, disposed on the rewiring layer, an antenna metal layer, formed on the packaging layer, an antenna circuit chip, bonded to the first metal layer of the rewiring layer, and electrically connected to the antenna metal layer through the metal connecting column; and a metal bump, formed on the first metal wiring layer of the rewiring layer, to achieve electrical lead-out of the rewiring layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.