Stripping liquid, stripping method, and electronic-component fabricating method
US11118110B2 · kind B2 · utility
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2References
10Claims
0Family size
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Key dates
| Filing date | Oct 30, 2019 |
| Grant date | Sep 14, 2021 |
| Priority date | — |
| Expiry date | Oct 30, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68381
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
According to one embodiment, a stripping liquid is provided. The stripping liquid is for removing a support plate from a stack. The stack includes a substrate, the support plate, and an adhesive. The Adhesive is placed between the substrate and the support plate. The adhesive includes a compound. The compound has a first functional group and a second functional group differing from each other. The stripping liquid includes a first solvent and a second solvent. The second solvent have a polarity higher than the first solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.