Method for manufacturing of pellicle
US11119402B2 · kind B2 · utility
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1References
8Claims
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Key dates
| Filing date | Aug 25, 2017 |
| Grant date | Sep 14, 2021 |
| Priority date | — |
| Expiry date | Aug 20, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/306
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for manufacturing of a pellicle that can simplify the manufacturing process is provided. The method for manufacturing of a pellicle comprises a step for forming a SiC film on a bottom surface of a Si substrate, a step for bonding a supporting member including a through hole to a bottom surface of the SiC film, and a step for removing the Si substrate, after bonding the supporting member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.