Patent assignee · JP · COMPANY

Air Water Inc.

45Patents
39Active
45Granted
53Portfolio score

Filing activity: Apr 20, 2000 → Jan 20, 2022 · 13 expiring within 5 years

Most-cited patents

PatentTitleAreaCited byStatus
US8411415B2 Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor Emerging Cross-Sectional Technologies 60 Active
US11485635B2 Hydrogen generator Chemistry; Metallurgy 12 Active
US10186421B2 Composite semiconductor substrate Electricity 7 Active
US8871350B2 Gas barrier film, electronic device including the same, gas barrier bag, and method for producing gas barrier film Emerging Cross-Sectional Technologies 5 Active
US7691203B2 Film forming apparatus Chemistry; Metallurgy 3 Expired
US8158095B2 Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor Emerging Cross-Sectional Technologies 2 Active
US8293860B2 Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor Emerging Cross-Sectional Technologies 2 Active
US8658120B2 Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor Emerging Cross-Sectional Technologies 2 Active
US7994271B2 Phenolic resin, production method and use thereof Chemistry; Metallurgy 2 Active
US9453277B2 Method of heat treatment and the directions for use of furnace of heat treatment Mechanical Engineering; Lighting; Heating 1 Active
US8742128B2 Process for producing pyridine compound, and pyridine compound Chemistry; Metallurgy 1 Active
US7047749B2 Regenerative refrigerating apparatus Emerging Cross-Sectional Technologies 1 Expired
US8409756B2 Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor Emerging Cross-Sectional Technologies 1 Active
US8603901B2 Method for producing single crystal SiC substrate and single crystal SiC substrate produced by the same Electricity 1 Active
US7041155B1 Selective adsorbent for nitrogen and method for separating air using the same Emerging Cross-Sectional Technologies 1 Expired
US11626283B2 Compound semiconductor substrate, a pellicle film, and a method for manufacturing a compound semiconductor substrate Electricity 0 Active
US8563442B2 Method for manufacturing nitrogen compound semiconductor substrate and nitrogen compound semiconductor substrate, and method for manufacturing single crystal SiC substrate and single crystal SiC substrate Electricity 0 Active
US12129973B2 Liquefied fluid supply system and liquefied fluid-spraying apparatus Mechanical Engineering; Lighting; Heating 0 Active
US11231647B2 Pellicle and method for manufacturing pellicle Electricity 0 Active
US10400086B2 Thermal expandability adjuster, use as thermal expandability adjuster, thermoset resin composition, insulating material, sealing material and conductive paste each containing thermoset resin composition, cured products, prepreg and member obtained by curing thermoset resin composition of prepreg, method of adjusting thermal expansion rate, and member manufactured using method of adjusting Electricity 0 Active
US12230679B2 Compound semiconductor substrate including nitride semiconductor layer having varying threading dislocation densities Electricity 0 Active
US9562533B2 Cryogenic pump for liquefied gases Mechanical Engineering; Lighting; Heating 0 Active
US8940931B2 Production method for refined 6-bromo-2-naphthalenecarboxylic acid product Chemistry; Metallurgy 0 Active
US10354864B2 Compound semiconductor substrate with SiC layer Electricity 0 Active
US8549878B2 Method of generating nitrogen and apparatus for use in the same Mechanical Engineering; Lighting; Heating 0 Active

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.