Patent · US Active

Packaged die stacks with stacked capacitors and methods of assembling same

US11121074B2 · kind B2 · utility

2Cited by

2References

7Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Bok Eng Cheah · Air Itam, MY
Mooi Ling Chang · Bayan Lepas, MY
Ping Ping Ooi · Butterworth, MY
Jackson Chung Peng Kong · Merang, MY
Wen Wei Lum · Kampung Sungai Pau, MY

Key dates

Filing date	Mar 16, 2020
Grant date	Sep 14, 2021
Priority date	—
Expiry date	Mar 16, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19105
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A stacked-die and stacked-capacitor package vertically arranged capacitors to mirror a semiconductive-device stack. The stacked capacitor can be electrically coupled to one or more semiconductive devices in the stacked architecture.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.