Semiconductor die with conversion coating
US11121076B2 · kind B2 · utility
0Cited by
19References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2019 |
| Grant date | Sep 14, 2021 |
| Priority date | — |
| Expiry date | Jul 10, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/35121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die includes a semiconductor layer, an electrical contact on a first side of the semiconductor layer, a backside electrical contact layer on second side of the semiconductor layer. The die further includes a zinc layer over at least one of the electrical contact or the backside electrical contact layer of the die, and a conversion coating over the zinc layer. The conversion coating includes at least one of zirconium and vanadium. As part of an embedded die package including the die, at least a portion of the conversion coating may adjacent to an electrically insulating substrate of the embedded die package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.