Sub-ground rule e-Fuse structure
US11121082B2 · kind B2 · utility
0Cited by
16References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2019 |
| Grant date | Sep 14, 2021 |
| Priority date | — |
| Expiry date | Apr 17, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/5256
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An e-Fuse device including a first electronic feature and a second electronic feature comprised of a conductive material, each of the first electronic feature and the second electronic feature having a width at least as great as a ground rule of a patterning process; and a fuse element comprised of the conductive material having a width less than the ground rule of the patterning process, the fuse element connecting a bottom portion of the first electronic feature and a bottom portion of the second electronic feature. Also disclosed is a method of making the e-Fuse device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.