Patent · US Active

Packaged device having imbedded array of components

US11122678B2 · kind B2 · utility

0Cited by

0References

14Claims

0Family size

Assignee

Tesla, Inc. · US

Inventors

Vijaykumar Krithivasan · Chandler, US
Jin Zhao · San Jose, US
Mengzhi Pang · Cupertino, US
Steven Butler · San Jose, US
Ganesh Venkataramanan · Sunnyvale, US
Yang Sun · Chandler, US

Key dates

Filing date	Jan 6, 2020
Grant date	Sep 14, 2021
Priority date	—
Expiry date	Jan 6, 2040

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A structure having imbedded array of components is described. An example structure includes an imbedded component array layer having an array of imbedded passive devices contained therein. The structure further includes an Integrated Fan-Out (InFO) layer residing adjacent a first surface of the imbedded component array layer having traces and vias formed therein. The structure further includes an insulator layer residing adjacent a second surface of the imbedded component array layer and electrically coupled to at least the InFO layer and vias passing through the imbedded component array layer and electrically coupled to some of vias of the InFO layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.