Yang Sun
6Patents
2h-index
14Co-inventors
44Inventor score
Filing activity: Apr 16, 2004 → Apr 8, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7144803B2 | Methods of forming boron carbo-nitride layers for integrated circuit devices | Electricity | 14 | Expired |
| US10700051B2 | Multi-chip packaging | Electricity | 3 | Active |
| US11122678B2 | Packaged device having imbedded array of components | Emerging Cross-Sectional Technologies | 0 | Active |
| US11817444B2 | Multi-chip packaging | Electricity | 0 | Active |
| US12199085B2 | Multi-chip packaging | Electricity | 0 | Active |
| US11348911B2 | Multi-chip packaging | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.