Passive methods of loose die identification
US11122680B2 · kind B2 · utility
0Cited by
12References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2019 |
| Grant date | Sep 14, 2021 |
| Priority date | — |
| Expiry date | Aug 8, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Embodiments of the invention are directed to a method and resulting structures for identifying an integrated circuit (IC) chip using optically-unique features. In a non-limiting embodiment of the invention, an imaging device generates an image of the chip. One or more optical features of the chip within the image can be determined and stored in a local or remote database. Metadata associated with the chip can be generated and linked with the one or more optical features of the chip and a unique identifier of the chip in the database.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.