Eric Marz
5Patents
0h-index
26Co-inventors
37Inventor score
Filing activity: Jan 3, 2014 → Sep 8, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11422597B2 | Predetermining separate thermal control points for chips of a multi-chip module | Emerging Cross-Sectional Technologies | 0 | Active |
| US12189415B2 | Providing deterministic frequency and voltage enhancements for a processor | Emerging Cross-Sectional Technologies | 0 | Active |
| US11122680B2 | Passive methods of loose die identification | Physics | 0 | Active |
| US9209082B2 | Methods of localized hardening of dicing channel by applying localized heat in wafer kerf | Electricity | 0 | Active |
| US12406119B2 | Processor chip timing adjustment enhancement | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.