Coolant and a method to control the pH and resistivity of coolant used in a heat exchanger
US11125512B2 · kind B2 · utility
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4References
6Claims
0Family size
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Key dates
| Filing date | Mar 29, 2017 |
| Grant date | Sep 21, 2021 |
| Priority date | — |
| Expiry date | Jun 4, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Implementations described herein generally relate to substrate processing equipment and more particularly to methods and compositions for temperature control of substrate processing equipment. In one implementation, a method of cooling a processing chamber component is provided. The method comprises introducing an inert purge gas into a supply reservoir containing a coolant and flowing the treated coolant to a processing chamber component to cool the processing chamber component. The coolant initially comprises deionized water and a water-soluble base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.