Method of fastening a semiconductor chip on a lead frame, and electronic component

US11127602B2 · kind B2 · utility

Assignee

• Osram OLED GMBH · DE

Inventors

• Mathias Wendt · Eschborn, DE
• Klaus Müller · Wilhelmsfeld, DE
• Laurent Tomasini · Reutte, AT

Key dates

• Filing date: Feb 28, 2018
• Grant date: Sep 21, 2021
• Expiry date: Feb 28, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/12041
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method of attaching a semiconductor chip to a lead frame, including A) providing a semiconductor chip, B) applying a solder metal layer sequence on the semiconductor chip, C) providing a lead frame, D) applying a metallization layer sequence on the lead frame, E) applying the semiconductor chip on the lead frame via the solder metal layer sequence and the metallization layer sequence, and F) heating the arrangement produced under E) to attach the semiconductor chip to the lead frame, wherein the solder metal layer sequence includes a first metallic layer including an indium-tin alloy, a barrier layer arranged above the first metallic layer, and a second metallic layer including gold arranged between the barrier layer and the semiconductor chip.