Mathias Wendt
9Patents
1h-index
11Co-inventors
40Inventor score
Filing activity: May 28, 2015 → Jun 29, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11094559B2 | Method of fastening a semiconductor chip on a lead frame, and electronic component | Electricity | 1 | Active |
| US11315898B2 | Method for fastening a semiconductor chip on a substrate, and electronic component | Electricity | 1 | Active |
| US10046408B2 | Device comprising a connecting component and method for producing a connecting component | Electricity | 0 | Active |
| US11961820B2 | Method for producing a connection between component parts, and component made of component parts | Electricity | 0 | Active |
| US11545369B2 | Method of fastening a semiconductor chip on a lead frame, and electronic component | Electricity | 0 | Active |
| US10204880B2 | Device and method for producing a device | Electricity | 0 | Active |
| US11842980B2 | Method for producing an electronic component, wherein a semiconductor chip is positioned and placed on a connection carrier, corresponding electronic component, and corresponding semiconductor chip and method for producing a semiconductor chip | Electricity | 0 | Active |
| US11127602B2 | Method of fastening a semiconductor chip on a lead frame, and electronic component | Electricity | 0 | Active |
| US10431715B2 | Device and method for producing a device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.