Patent · US Active

Back end of the line metal structure and method

US11127674B2 · kind B2 · utility

0Cited by
7References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 16, 2019
Grant dateSep 21, 2021
Priority date
Expiry dateOct 16, 2039

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L23/53228
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Disclosed are embodiments of a back end of the line (BEOL) metal structure that includes, within a metal level, a metal via, which has at least eight sides and all interior angles at 135° or more, and a metal wire thereon. The metal wire and via include respective portions of a continuous conformal metal layer. A passivation layer coats the top surface of the metal layer. The metal via and the metal wire thereon can be in an upper metal level and can be made of one metal (e.g., aluminum or an aluminum alloy). The upper metal level can be above a lower metal level that similarly includes a metal via and metal wire thereon, but the metal used can be different (e.g., copper) and/or the shape of the via can be different (e.g., four-sided). Also disclosed herein are method embodiments for forming the above-described BEOL metal structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.