Patent · US Active

Method for transferring structures

US11127710B2 · kind B2 · utility

1Cited by
1References
26Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 5, 2019
Grant dateSep 21, 2021
Priority date
Expiry dateSep 14, 2039

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10H20/857
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A transfer method includes steps of a) supplying a support layer having a first face, structures being assembled by their front face on the first face, and c) transferring the structures onto a host face of a host substrate. The support layer includes folding regions, between the structures, adapted to pass from a folded state to an unfolded state under the action of an external excitation. Between steps a) and c), a step b) is included of executing the external action in such a way as to make the folding regions pass from the folded state to the unfolded state such that the spacing between the structures varies.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.