Method for transferring structures
US11127710B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 5, 2019 |
| Grant date | Sep 21, 2021 |
| Priority date | — |
| Expiry date | Sep 14, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A transfer method includes steps of a) supplying a support layer having a first face, structures being assembled by their front face on the first face, and c) transferring the structures onto a host face of a host substrate. The support layer includes folding regions, between the structures, adapted to pass from a folded state to an unfolded state under the action of an external excitation. Between steps a) and c), a step b) is included of executing the external action in such a way as to make the folding regions pass from the folded state to the unfolded state such that the spacing between the structures varies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.