Conductive interconnects suitable for utilization in integrated assemblies, and methods of forming conductive interconnects
US11127899B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2019 |
| Grant date | Sep 21, 2021 |
| Priority date | — |
| Expiry date | Apr 18, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N70/231
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Some embodiments include an integrated assembly having an insulative mass over a conductive base structure. A conductive interconnect extends through the insulative mass to an upper surface of the conductive base structure. The conductive interconnect includes a conductive liner extending around an outer lateral periphery of the interconnect. The conductive liner includes nitrogen in combination with a first metal. A container-shaped conductive structure is laterally surrounded by the conductive liner. The container-shaped conductive structure includes a second metal. A conductive plug is within the container-shaped conductive structure. Some embodiments include methods of forming conductive interconnects within integrated assemblies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.