Low-force wafer test probes

US11131689B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• David M. Audette · Webster, US
• S J. Chey · Mount Kisco, US
• Doreen D. DiMilia · Pleasantville, US
• Sankeerth Rajalingam · Peekskill, US
• Grant Wagner · Jericho, US

Key dates

• Filing date: May 25, 2017
• Grant date: Sep 28, 2021
• Expiry date: Jun 20, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L22/30
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Embodiments herein describe structures of low-force wafer test probes and formation thereof. Structures of low-force wafer test probes and their formation via gray scale etch or electroplating is described. Structures are described that include a lower base structure on top of a substrate and an upper blade structure on top of the lower base structure. In various embodiments, a crown of a C4 bump is accommodated by one or both of: i) a cavity present in the lower base structure; and ii) a height of the upper blade structure. Processes for fabricating probe structures are described that include forming lower base structures upon a substrate and forming upper blade structures on top of the lower base structures. The upper blade structures include at least one blade. Each of the blade(s) include a cutting edge that points toward a center point within the probe structure.