Substrate treating method and substrate treating apparatus
US11133175B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2017 |
| Grant date | Sep 28, 2021 |
| Priority date | — |
| Expiry date | Mar 18, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67248
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate treating method and a substrate treating apparatus which can reduce the collapse of a pattern on a substrate. The substrate treating method includes a supply step of supplying a process liquid including a sublimable substance in a molten state to a pattern-formed surface of a substrate; a solidification step of solidifying the process liquid on the pattern-formed surface so as to form a solidified body; a sublimation step of subliming the solidified body so as to remove the solidified body from the pattern-formed surface; and an organic substance removal step of removing, when the solidified body is sublimed, an organic substance precipitated on a sublimation interface, and the organic substance removal step is performed so as to overlap at least part of the sublimation step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.